The OM Thermal Stress System is a performance based reliability test methodology which performs:
- Convection reflow assembly simulation per IPC TM-650 2.6.27
- Air-to-air thermal shock per IPC TM-650 2.6.7.2
OM Advantages
- IPC-2221 Appendix A type D coupons
- Web based generator
- 0.550" x 1.875"
- Thickness up to 0.250"
- Press-fit headers
- No soldering or cleaning required
- Data Acquisition
- 4-wire precision resistance
- 1 reading per net every second
- 24 coupons per chamber load
- Software
- Automatic data analysis and report generation
- Simple temperature profile generation
- In-situ temperature calibration using external standard
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